High-current DC power busbars for AI data centers, OCP Open Rack, and ORv3 rack systems.
Designed for reliable power distribution across power shelf, PSU, BBU/CBU, PCS, servers, storage, and network switches. Available in copper, aluminum, and flexible configurations for application-specific requirements. Applications: OCP Open Rack and ORv3 AI server racks, BBU/CBU racks, PCS racks, and customized power distribution systems.
1. High-Density Rack Power Busbars
The power distribution busbar features low-resistance conduction and reliable insulation for high-current, low-loss power interconnection. Its compact design supports customized dimensions and mounting options for high-power-density racks.
- Supports 12-48 VDC busbar systems
- 18–100 kW rated power
- Reliable insulation, low resistance
- Supports compact 1U configurations, custom form factors, and thin copper profiles.
Ideal for
- OCP Open Rack / BBU & PCS Racks
- Power Shelf / BBU Shelf / CBU Shelf
- PSU / PDU Power & Distribution Systems
- AI Data Centers & HPC Systems
- Server Racks & DC Power Distribution
2. OCP ORv3 Rack Busbars
The rack busbar is designed for OCP Open Rack / ORv3 data center racks, supporting DC power interconnection for Powershelf, PSU, BBU/CBU Shelf, servers, storage, and network switches. Supports 48–54 VDC and 300–1400 A for high-density rack power distribution.
- 48–54 VDC Busbar Interconnection
- Rated Current: 300 / 600 / 1200 / 1400 A
- Recommended Rack Height: 440U–500U
- Plated Copper for Reliable Connections
- OCP ORv3 48V DC Busbar Geometry, Compatible with Multiple Connector Ratings
Ideal for
- OCP Open Rack / ORv3 Server Racks
- Power shelf / PSU Power Systems
- BBU Shelf & Rack Power Systems
- IT Servers, Storage & Network Switches
- Custom Data Center Racks
3. Liquid-Cooled Rack DC Busbar
As rack power density increases, liquid-cooled rack busbars offer enhanced thermal performance over conventional forced-air cooling. Integrated with liquid-cooled rack systems, they improve heat transfer at the busbar and shelf levels for more efficient cooling and power delivery in high-density data centers.
Features
- Temperature Rise: <30°C (All Operating Conditions)
- Voltage Drop: <0.1 V @ 440U Rack Height
- Pressure Drop: <40 PSI @ 440U, 5 LPM
- Recommended Flow Rate: 0.15–5 LPM (Max. 1.32 GPM); IEC 62368-1 G.15 Compliant; Leak-Resistant, Non-Contaminating, Corrosion-Resistant
Application: OCP liquid-cooled data center racks for high-power-density servers and rack-level DC power systems, combining high-current power delivery with liquid cooling.