RHI Showcases AI Data Center Power Connection Solutions at DCW Asia 2026

On September 29–30, 2026, Data Centre World Asia 2026 took place at Marina Bay Sands Expo and Convention Centre in Singapore. RHI successfully participated in the event, engaging with companies across the global data center ecosystem and industry professionals to exchange insights on technology trends. The company showcased high-current power connection and thermal management solutions designed for high-density computing and AI data center applications.

As a provider specializing in high-current interconnect solutions, RHI presented a range of products tailored to the power distribution requirements of modern data centers. Key exhibits included rack busbars, power busbars, and rack busbar solutions designed for OCP ORv3 compliant applications. To address the power delivery and thermal management demands of high-power-density systems, RHI also showcased liquid-cooled rack DC busbars, liquid cooling quick couplings, and optical module thermal management solutions. Together, these products support critical electrical connection and cooling applications across data center infrastructure.

Addressing AI Computing Demands with High-Density Power Distribution Solutions

As AI training and inference workloads continue to grow, server power requirements are increasing, placing greater demands on rack power distribution systems in terms of current-carrying capacity, space efficiency, energy efficiency, and temperature rise control.

To address these challenges, RHI showcased power busbars and rack busbar solutions designed for high-power-density server racks in AI data centers. Through optimized conductor design, reduced electrical resistance, and compact layouts, these solutions provide reliable hardware support for high-current power transmission and help meet the growing power demands of high-density computing environments.

For data centers adopting OCP ORv3 architectures, RHI also presented rack busbar solutions designed for relevant rack power distribution applications, providing product support for power distribution and electrical connectivity in high-power server systems.

Enhancing Power Delivery and Thermal Management for Liquid-Cooled Data Centers

As liquid cooling becomes increasingly prevalent in high-power-density data centers, greater attention is being paid to the structural integration of power components, heat transfer paths, and operating temperature control.

At the exhibition, RHI showcased liquid-cooled rack DC busbar solutions that address high-current DC power transmission requirements in liquid-cooled data center environments. Thermal simulation is used to support the evaluation and optimization of product structures and thermal performance, helping improve thermal design suitability and operational reliability under high-load conditions.

RHI also exhibited liquid cooling quick coupling solutions for fluid connections in liquid cooling systems, as well as optical module thermal management solutions designed to address the heat dissipation requirements of high-speed optical communication equipment. These products support data center infrastructure across several critical areas, including power transmission, fluid connectivity, and thermal management of key components.

Strengthening Industry Collaboration and Advancing Customized Solutions

During the exhibition, RHI engaged with data center operators, system integrators, engineering professionals, and industry experts from various regions. Discussions covered AI computing infrastructure, high-density server power delivery, rack power architectures, and liquid cooling technologies, providing further insights into the industry's evolving requirements for high-current interconnects and thermal management solutions.

Looking ahead, RHI will continue to advance the development and application of high-current interconnect and thermal management technologies across AI data centers, new energy systems, and power distribution applications. Leveraging its capabilities in customized design, product manufacturing, and quality control, RHI aims to deliver electrical connection solutions tailored to different system architectures and operating conditions, helping global customers achieve efficient and reliable power transmission in data center infrastructure.

For customized data center power connection solutions, please contact RHI. Our team provides product design and manufacturing support based on specific application scenarios and technical requirements, working with customers to address the engineering challenges of high-power-density power delivery in AI data centers.