Data Center Busbar
Power Busbars are designed for OCP Power Shelves, BBU/CBU shelves, and rack-mounted PCS systems, delivering high-current, low-loss power distribution. Custom dimensions, copper thicknesses, configurations, and mounting options are tailored to specific equipment requirements, enabling precise integration into compact 1U layouts and high-density power systems.
| Operating Voltage | 12–48 V DC |
|---|---|
| Rated Power | 18–100 kW |
| Installation Height | Custom 1U Design |
| Electrical Performance | Reliable Insulation, Low Electrical Resistance |
| Customization | Dimensions, Current Rating, Material & Mounting |
| Design Standards | OCP Open Rack Specifications |
| Applications | Power Shelves, BBU Racks, Rack-Mounted PCS |
The rapid growth of AI computing is driving data centers toward higher rack power densities and more integrated power architectures. As AI rack power requirements exceed 100 kW in some deployments, 48V DC power distribution must accommodate increasingly high current levels, placing greater demands on conductor capacity, voltage drop, thermal management, and installation space. Busbar design has therefore become a critical factor in reliable, high-density power delivery.
RHI Power Busbars are designed for internal power distribution and interconnection in OCP data center Power Shelves, BBU/CBU shelves, rack-mounted PCS, and PDU assemblies. Operating across 12–48V DC applications, they connect multiple power modules and provide reliable current paths to downstream power distribution interfaces.
Available in custom-formed copper, laminated busbars, insulated busbar assemblies, and cable-integrated solutions, RHI Power Busbars are engineered around specific equipment requirements. Conductor cross-sections, copper thickness, dimensions, structural configurations, and mounting methods can all be customized to match current ratings, thermal requirements, and available installation space.
As power architectures evolve, busbar designs must be reassessed to accommodate changing current loads and mechanical constraints. With flexible OEM customization and application-specific engineering, RHI delivers low-resistance, space-efficient power interconnect solutions with reliable electrical insulation, supporting compact power shelf designs and high-density AI data center applications.
| Operating Voltage | 12–48 V DC |
|---|---|
| Rated Power | 18–100 kW |
| Installation Height | Custom 1U Design |
| Electrical Performance | Reliable Insulation, Low Electrical Resistance |
| Customization | Dimensions, Current Rating, Material & Mounting |
| Design Standards | OCP Open Rack Specifications |
| Applications | Power Shelves, BBU Racks, Rack-Mounted PCS |
AI BBU and storage racks
RHI bends, punches, welds, rivets, and dips in-house, and uses automatic robots to raise capacity. A project engineering team helps customers hold cost and keep the connection stable.
Rack Busbars are designed for OCP ORv3 systems and high-density AI data centers, delivering high-current DC power distribution from 425A to 2900A. Featuring a laminated structure and blind-mate connections, they simplify installation, reduce cabling, and improve airflow. Custom designs are available for different rack configurations and power requirements.
As AI computing drives higher rack power density, OCP liquid-cooled racks provide efficient thermal management for high-power data centers. Direct liquid-cooled busbars further enhance heat dissipation at the busbar and shelf levels, enabling higher-current power distribution and supporting high-density rack architectures.
RHI OCP-Compatible Power Cable Assemblies are designed for OCP V3 IT power distribution systems, providing reliable connections between busbars, cables, and circuit boards. Featuring dedicated power, chassis ground, and sense contacts, they support stable power transmission, additional grounding protection, and hot-swappable operation. With high current-carrying capacity and low contact resistance, RHI cable assemblies offer customized current ratings for high-power data center applications.
Copper busbars made from C110 undergo stamping, CNC bending, finishing, and insulation. Finishes include bare copper, tin, nickel, or silver plating, with insulation options like PVC, PE heat shrink, epoxy coating, or PA12. They are commonly used in energy storage systems, charging stations, electric forklifts, and EV battery packs.
Engineered for high-voltage EV battery systems, these battery busbars combine high-conductivity copper with heat-resistant ceramic composite tape to ensure excellent insulation, thermal stability, and mechanical strength. RHI's automated winding process delivers precise, uniform wrapping—critical for maintaining performance under extreme temperatures. A reliable solution for demanding new energy applications.
Flexible busbars, made from thin layers of copper foil or strips and covered with a heat shrink insulation layer, offer excellent conductivity and heat dissipation. Compared to rigid copper busbars, they are lighter and allow for more flexible and adaptable installation. Flexible copper busbars are widely used in EV battery packs, distribution cabinets, energy batteries, solar panels, etc.
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