RACK BUSBAR

  1. Your Location
  2. Home
  3. PRODUCTS
  4. RACK BUSBAR
OCP ORV3 48V DC Laminated Rack Busbar for AI Data Centers
OCP ORV3 48V DC Laminated Rack Busbar for AI Data Centers
OCP ORV3 48V DC Laminated Rack Busbar for AI Data Centers
OCP ORV3 48V DC Laminated Rack Busbar for AI Data Centers

OCP ORV3 48V DC Laminated Rack Busbar for AI Data Centers

Engineered for AI data centers and OCP ORV3 Open Rack architectures, this rack busbar delivers high-density power distribution through a low-inductance laminated design, enabling efficient power delivery from Power Shelves and PSU modules to compute nodes. Supporting BBU systems, AI servers, storage platforms, and network equipment, the copper busbar replaces conventional cable assemblies to minimize voltage loss, improve rack thermal performance, and simplify maintenance in high-power AI computing environments.

  • Plating： Tin plating, nickel plating
  • MOQ： 100
  • Size： Customized
  • Conductor Material： C11000 copper
  • Insulation： FR-4 fiberglass epoxy board
Online Inquiry

Product Features

  • Supports 48VDC–54VDC rack-level DC power distribution with flexible current configurations from 300A to 1400A.

  • Developed for OCP ORV3 Open Rack platforms, ensuring mechanical compatibility and seamless integration across busbar connector interfaces.

  • High-conductivity plated copper terminals minimize contact resistance, maintain stable thermal characteristics, and support reliable hot-swap maintenance operations.

  • Advanced low-inductance laminated busbar construction with flame-retardant insulation enhances power efficiency, heat dissipation, and structural durability compared with conventional cable solutions.


ParameterCurrent RatingRoHSInsulation MaterialVoltage RatingConductor Material
Values300A/600A/1.2kA/1.4kAQualifiedFR-4 insulation board48VDC-54VDCT2Y2 copper


label: Power Distribution Busbar AI Data Center

Related Content