As a global provider specializing in high-current interconnect technology, RHI showcased power connection and thermal management products designed for high-density computing and AI data centers. These included rack busbars, power busbars, and OCP ORv3 rack busbars, delivering reliable and efficient power transmission for data center power distribution systems and server racks.
2026-10-15 14:14:06 Silin Wu 7
The growth of generative AI is rapidly increasing data center power density, pushing traditional low-voltage systems beyond their limits. As AI rack power approaches 1MW and GPU energy demand continues to rise, 800V HVDC is becoming the preferred power architecture for next-generation AI infrastructure. With higher efficiency, lower copper usage, improved reliability, and stronger support for high-density computing, 800V HVDC is reshaping modern data center power distribution and driving demand for advanced busbar and power interconnection solutions.
2026-05-20 13:39:27 Silin Wu 296