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Why should be electroplated layer on the suface of busbar

Category: Busbar Knowledge, News   |   Tags:
Date: 06 / 24 / 2017

Why should be electroplated layer on the suface of busbar

There is electroplated layer on the suface of busbar to reduce the “contact resistance”.Any two conductors meet,besides the individual resistance of conductor.There is also “contact resistance” on the contact surface.The contact resistance is related to the finish of the contact surface.The area of contact and the material itself.Tin plating on the contact surface is used to make full use of the copper .To increase contact area under proper pressure.To increase contact area under proper pressure.And it is not easy to rust and corroded.The copper bar is used for hanging tin plating method.To increase contact area under proper pressure.And at least one anode plate and cathode plate are set in the tank. The anode plate is connected to the positive pole of the power supply.

The cathode plate is connected with the copper busbar.To increase contact area under proper pressure.and it  can be used to place the electroplating bath.The copper platoon is coated with tin coating to prevent oxidation.However,the copper platoon and the contact point of the power connection are fixed.To increase contact area under proper pressure.The current density around the contact point of its electric connection is smaller.and the corresponding current density is smaller.Resulting in uneven surface electroplating on the copper busbar.To increase contact area under proper pressure.

Why should be electroplated layer on the suface of busbar

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Why should be electroplated layer on the suface of busbar

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RHI focus on new energy battery copper busbar connection、flexible battery connector、braided busbar and other insulated covers.

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